How are Ceramic Substrates Made?

Ceramic substrates play a crucial role in the electronics industry, etenkin sovelluksissa, joissa on korkea - performance thermal, electrical, and mechanical properties are required. Understanding how these substrates are made can help manufacturers, insinöörit, and hobbyists make informed decisions when choosing the right substrate for their projects. This blog post will delve into the detailed manufacturing processes of ceramic substrates, exploring the key steps and techniques involved.

• Alumina (\(Al_2O_3\)): Alumina is one of the most commonly used ceramic materials for substrates. It offers a good balance of properties, including high mechanical strength, chemical stability, and relatively low cost among ceramic materials. It has a dielectric constant in the range of 9 - 10, which is suitable for many electrical applications. Esimerkiksi, in the production of substrates for general - purpose electronics, alumina is often the material of choice.

• Aluminum Nitride (AlN): AlN is known for its excellent thermal conductivity, which can range from 150 - 200 W/(m·K). It also has a coefficient of thermal expansion (CTE) that is closer to that of silicon, making it an ideal material for applications where good heat dissipation and compatibility with semiconductor components are crucial, such as in power electronics for electric vehicles.

• Silicon Nitride (\(Si_3N_4\)): \(Si_3N_4\) ceramic substrates are valued for their high - temperature stability, good mechanical strength, and electrical insulation properties. They are often used in applications that require operation in harsh environments, such as aerospace and defense electronics.

• Dry Pressing: In dry pressing, ceramic powder is mixed with a binder and placed into a mold. High pressure is then applied to compact the powder into the shape of the mold. This method is suitable for producing simple - shaped and high - volume ceramic substrates. Esimerkiksi, some basic rectangular or square - shaped ceramic substrates for consumer electronics may be produced using dry pressing. After pressing, the green (unfired) ceramic part is carefully removed from the mold.

• Injektiomuovaus: Injection molding is a more complex but versatile method. The ceramic powder is mixed with a plastic binder to form a feedstock, which is then injected into a mold cavity under high pressure. This method allows for the production of complex - shaped ceramic substrates with high precision. Esimerkiksi, substrates with intricate internal channels for cooling in high - power electronics can be created using injection molding. After injection, the green parts need to be carefully removed from the mold and prepared for the next step.

• Doctor Blade Method: The doctor blade method is often used for producing thin - film ceramic substrates. A slurry of ceramic powder, sideaine, and solvent is spread onto a flat surface using a doctor blade. The thickness of the slurry layer is controlled by the gap between the blade and the surface. This method is suitable for applications where very thin ceramic layers are required, such as in some microelectronics devices. After spreading, the slurry - coated substrate is dried to remove the solvent and form a green ceramic film.

• Furnace Types: Different types of furnaces can be used for sintering, such as electric resistance furnaces, kaasu - poltetut uunit, or even microwave furnaces. The choice of furnace depends on factors like the size of the substrate, the type of ceramic material, and the required heating rate and temperature uniformity.

• Temperature and Time: The sintering temperature varies depending on the ceramic material. Esimerkiksi, alumina substrates are typically sintered at temperatures between 1600 - 1800 ° C, while AlN and \(Si_3N_4\) may require even higher temperatures. The sintering time also plays a crucial role. Too short a time may result in incomplete densification, while too long a time can cause grain growth and affect the mechanical properties. During sintering, the ceramic particles bond together, reducing porosity and increasing the density of the substrate. This process significantly improves the mechanical strength, electrical insulation, and thermal conductivity of the ceramic substrate.

• Direct Bonded Copper (DBC): In the DBC process, a copper foil is directly bonded to the ceramic surface. Ensimmäinen, the ceramic substrate and the copper foil are cleaned and prepared. Sitten, they are placed in a high - lämpötilauuni. At around 1065 - 1083 ° C, an oxygen - containing atmosphere is introduced. This causes the formation of a eutectic liquid phase between the copper and oxygen. The liquid phase reacts with the ceramic surface, forming compounds such as \(CuAlO_2\) tai \(Cu(AlO_2)_2\) (in the case of alumina - based ceramics), which bond the copper foil to the ceramic substrate. After bonding, the copper layer can be etched to form the desired circuit patterns. DBC is widely used in power electronics applications due to its high thermal conductivity and good electrical performance.

• Active Metal Brazing (AMB): AMB is a more advanced metallization technique. Tässä prosessissa, an active metal brazing alloy, which contains elements like titanium (Ti), hopea (Ag), ja kupari (Cu), käytetään. Ensimmäinen, the active metal brazing alloy is applied to the ceramic surface, either by screen - printing or other deposition methods. Sitten, a copper layer (or other metal layer) is placed on top. The assembly is heated in a furnace under a controlled atmosphere. The active metal in the brazing alloy reacts with the ceramic surface, forming a chemical bond. This bond allows the liquid brazing alloy to wet the ceramic and metal surfaces, creating a strong joint. AMB is often used for high - power and high - reliability applications, such as in aerospace and automotive power electronics, as it provides a very strong bond between the ceramic and metal layers.

• Thin - Film Deposition: Thin - film deposition methods, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), can also be used for metallizing ceramic substrates. In PVD, a metal source is vaporized in a vacuum chamber, and the metal atoms are deposited onto the ceramic substrate surface. This method can produce very thin and precise metal layers, which are suitable for applications where high - density interconnects and fine - line patterning are required, such as in microelectronics. CVD, toisaalta, involves the reaction of gaseous precursors in a chamber. The reaction products deposit on the ceramic substrate surface, forming a metal layer. CVD can be used to deposit a variety of metals and metal compounds, and it offers good conformality, meaning it can coat complex - shaped substrates evenly.

• Photolithography and Etching: Photolithography is a commonly used technique for circuit patterning. A photoresist layer is applied to the metallized surface of the ceramic substrate. Sitten, a mask with the desired circuit pattern is placed over the photoresist. Ultraviolet (UV) light is shone through the mask, exposing the photoresist in the areas where the circuit pattern is to be formed. The exposed photoresist is then developed, removing either the exposed or unexposed parts depending on the type of photoresist used. After development, an etching process is carried out. An etchant, such as an acid solution in the case of copper metallization, is used to dissolve the metal in the unprotected areas, leaving behind the desired circuit pattern.

• Laser Ablation: Laser ablation is another option for circuit patterning, etenkin pienille - asteikko tai korkea - tarkkuussovellus. Korkea - energy laser beam is focused on the metallized surface of the ceramic substrate. The laser energy vaporizes or sublimates the metal in the areas where the beam is applied, removing the metal and creating the circuit pattern. Laser ablation can be used to create very fine - line circuits and is suitable for substrates with complex geometries or when traditional photolithography is not feasible.

• Pinnan viimeistely: Once the circuit patterns are created, the ceramic substrate may undergo surface finishing processes. This can include processes such as soldering mask application, which protects the circuit from environmental contaminants and prevents solder bridging during component assembly. Surface coatings, such as gold plating or nickel - palladium - gold plating, may also be applied to improve the solderability and corrosion resistance of the circuit pads.